Method for providing a near-field transducer (NFT) for a heat assisted magnetic recording (HAMR) device

ABSTRACT

A method and system provides a near-field transducer (NFT) for a heat assisted magnetic recording (HAMR) transducer. The method and system include forming the disk of the NFT and forming the pin of the NFT. The disk is formed from a first material. The pin is formed from a second material different from the first material. The pin contacts the disk. At least a portion of the pin is between the disk and an air-bearing surface (ABS) location.

BACKGROUND

FIG. 1 depicts a portion of a conventional heat assisted magneticrecording (HAMR) transducer 10. The conventional HAMR transducer 10includes a conventional waveguide 12 having a conventional core 18 andcladding 14 and 16, a conventional near-field transducer (NFT) 30, and awrite pole 40. The NFT 30 has a disk portion 34 and a pin portion 32.The pin portion 32 is between the disk portion 34 and the air-bearingsurface (ABS). The NFT 30 is typically formed of gold or a gold alloy.The conventional HAMR transducer 10 is used in writing to a recordingmedia and receives light, or energy, from a conventional laser (notshown).

In operation, light from a laser is coupled to the waveguide 12. Lightis guided by the conventional waveguide 12 to the NFT 30 near the ABS.The NFT 30 utilizes local resonances in surface plasmons to focus thelight to magnetic recording media (not shown), such as a disk. Thesurface plasmons used by the NFT 30 are electromagnetic waves thatpropagate along metal/dielectric interfaces. At resonance, the NFT 30couples the optical energy of the surface plasmons efficiently into therecording medium layer with a confined optical spot which is muchsmaller than the optical diffraction limit. This optical spot cantypically heat the recording medium layer above the Curie point innano-seconds. High density bits can be written on a high coercivitymedium with a pole 40 having modest magnetic field.

FIG. 2 depicts a conventional method 50 for providing the NFT 30 in theconventional HAMR transducer 10. Referring to FIGS. 1 and 2, a layer ofconductive material is deposited for the NFT, via step 52. Typically theconductive material is gold. The conductive layer is masked, via step54. The mask covers the portion of the conductive layer that will formthe NFT 30. The exposed portion of the conductive layer is removed, viastep 56. Step 56 typically includes performing an ion mill. Theremaining portion of the conductive layer forms the NFT. Thus, the NFT30 is formed. Fabrication of the conventional HAMR transducer 10 maythen be completed.

Although the conventional method 10 may form the conventional NFT 30,there are drawbacks. In particular, the conventional NFT 30 not performas desired. For example, due to heating during use, the pin portion 32of the NFT 30 may undergo plastic deformation. The metals used in theNFT 30 may also undergo softening at elevated temperatures. As a result,the NFT 30 may fail during operation. Accordingly, what is needed is asystem and method for improving performance of a HAMR transducer.

BRIEF DESCRIPTION OF SEVERAL VIEWS OF THE DRAWINGS

FIG. 1 is a flow chart depicting a conventional HAMR transducer.

FIG. 2 is a diagram depicting a plan and side views of a conventionalNFT formed using a conventional method for fabricating an NFT.

FIG. 3 is a flow chart depicting an exemplary embodiment of a method forproviding a composite NFT in a HAMR transducer.

FIG. 4 is a diagram depicting a side view of an exemplary embodiment ofa disk drive including a composite NFT formed using an exemplaryembodiment of the method.

FIG. 5 is a diagram depicting a plan view of an exemplary embodiment ofa composite NFT.

FIG. 6 is a diagram depicting an exemplary embodiment of a HAMR heademploying a composite NFT.

FIG. 7 is a flow chart depicting another exemplary embodiment of amethod for providing a disk drive including a composite NFT.

FIG. 8 is a flow chart depicting another exemplary embodiment of amethod for providing a composite NFT in a HAMR transducer.

FIGS. 9A and 9B-23A and 23B are diagrams depicting various portions ofan exemplary embodiment of a magnetic recording transducer duringfabrication.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

FIG. 3 depicts one embodiment of a method 100 for fabricating acomposite NFT for a HAMR transducer. For simplicity, some steps may beomitted, interleaved, and/or combined. The HAMR transducer beingfabricated may be part of a merged head that also includes a read headand resides on a slider in a disk drive. The method 100 is alsodescribed in the context of providing a single HAMR transducer. However,the method 100 may be used to fabricate multiple transducers atsubstantially the same time. The method 100 is also described in thecontext of particular layers. However, in some embodiments, such layersmay include multiple sub-layers. The method 100 also may commence afterformation of other portions of the HAMR transducer. In one embodiment,the method 100 commences after formation of portions of the waveguide,such as a core. Thus, a flat surface for formation of subsequentstructures may have been provided. Certain steps of the method 100 maybe combined, omitted, performed in another order and/or interleaved.

The disk of the NFT is formed from first material(s), via step 102. Insome embodiments, the first material(s) used for the NFT disk aremetallic. For example, gold or a gold alloy may be used. However, inother embodiments, other materials including but not limited to otheralloys and/or a combination of metals and insulators may be used.Although termed a disk herein, the disk of the NFT need not have acircular footprint. Other shapes, including shapes having aperturestherein might be used. For example, a triangular, rectangular orring-shaped NFT “disk” might be formed in step 102. The disk of the NFTis typically wider than the pin, discussed below, in the cross-trackdirection. However, the disk of the NFT need not be wider than the pin.The disk portion of the NFT is recessed from the air-bearing surface(ABS) location. The ABS location is the region which will become theABS, for example after lapping of the slider.

In some embodiments, step 102 includes multiple substeps. For example,one or more metallic layers may be deposited at least in the region inwhich the NFT is to be formed. A mask having the desired shape andlocation of the disk may then be provided. The exposed portion of themetallic layer(s) may then be removed. Alternatively, a lift-off processmight be used. Thus, a mask having an aperture with the shape andlocation of the disk may be provided. The first material(s) for the diskmay be deposited and the mask removed. In other embodiments, othermethods of forming the NFT disk may be used.

The NFT pin is formed from second material(s) different from the firstmaterial(s) used in the pin, via step 104. Further, step 104 isperformed using a lift-off process. At least part of the pin formed isbetween the disk and the ABS location. In some embodiments, a portion ofthe pin occupies part of the ABS. However, in other embodiments, the pinmay be recessed from the ABS location. The pin also contacts the disk.Thus, the NFT formed includes both the disk and the pin. In someembodiments, the pin is substantially rectangular in cross-section.

The material(s) used for the pin in step 104 are different from thematerial(s) used for the disk in step 102. Thus, the NFT formed is acomposite NFT. The pin may be formed of a dielectric. For example,tantalum oxide (e.g. Ta₂O₅), titanium oxide, silicon and/or anotherdielectric might be used in forming the pin.

Step 104 may also include multiple substeps and involves a lift-off. Forexample, a mask having an aperture may be provided. At least part of theaperture has a shape and a location of the pin. A remaining portion ofthe aperture may be used to form all or part of an anchor structure. Thesecond material(s) for the pin are deposited and the mask lifted-off.The pin is formed by at least part of the second material(s) remainingin the aperture's location after lift-off. As a result, the pin takes onthe geometry of the aperture in the mask. In some embodiments, the trackwidth of the pin is less than that of the disk. In other embodiments,however, the pin formed in step 104 may be wider in the track widthdirection than the disk. The pin may, for example, be at least fiftynanometers wide and not more than two hundred nanometers wide in someembodiments. After formation of the NFT pin, the region may be coveredwith a refill material. One or more planarizations may also beperformed. For example, a resist planarization and/or a light chemicalmechanical planarization (CMP) might be employed. A resist planarizationmay include depositing an endpoint detection layer between two refilllayers. These refill layers may correspond to cladding for thewaveguide. An ion mill planarizes the region around the NFT, terminatingin response to detection of the endpoint detection layer. Thus, the NFTmay be formed and protected.

Using the method 100 a composite NFT may be fabricated. For example,FIG. 4 depicts a disk drive 110 that includes an NFT 120 formed usingthe method 100. FIG. 5 depicts a plan view of an NFT 120 formed usingthe method 100 and that may reside in the disk drive 110. FIG. 6 depictsan embodiment of a head 150 utilizing the NFT 120 formed using themethod 100. FIGS. 4-6 are not to scale. Referring to FIGS. 4-6, forsimplicity, not all portions of the disk drive 110 and HAMR head 150 areshown. For example, electronics and a suspension that may be used withthe disk drive 110 and HAMR head 150 are not shown. In addition,although the disk drive 110 and HAMR head 150 are depicted in thecontext of particular components other and/or different components maybe used. Further, the arrangement of components may vary in differentembodiments.

The disk drive 110 includes media 112, a HAMR head 150 residing on aslider 111 and a laser assembly 115. The media 112 may be a disk orother magnetic recording media configured for use in the disk drive 110.The laser assembly 115 includes a laser 114 and submount 115. Althoughnot depicted in FIG. 4, the HAMR head 150 may include a read transducer152 (shown in FIG. 6). The read transducer 152 includes shields 154 and158 as well as read sensor 156. The read sensor 156 may be a tunnelingmagnetoresistance (TMR) sensor. Although being shown as disconnectedfrom the shields 154 and 158, in some embodiments, the read sensor 156is connected to the shields 154 and 158. In other embodiments, the readtransducer 152 may be omitted.

The HAMR head 150 also includes a write transducer 160. The HAMRtransducer 160 includes waveguide 170, write pole 168, return pole 166,coil(s) 164 and 165, and shield 162. The coil(s) 164 and 165 may be usedto energize the write pole 140 during writing. In the embodiment shown,the shield 162 is depicted as separate from the return pole 166.However, in another embodiment, these components may be combined. Thewaveguide 170 includes cladding 172 and 176 as well as core 174.Further, the waveguide 170 is shown as residing between the pole 168 andreturn pole 166. In another embodiment, other configurations arepossible. The coils 164 and 165 may form a single, helical coil or maybe separate pancake coils. In addition, a grating (not shown in FIGS.4-6) may be used to couple light from the laser 114 into the waveguide170.

The HAMR transducer 150 also includes an NFT 120 and optional heat sink180. The optional heat sink 180 is in thermal contact with the NFT 120.The heat sink 180 also has a top surface 182 in thermal contact with thepole 168. In the embodiment shown, the heat sink 180 is in directphysical contact with the NFT 120 and the pole 168. The top surface 182of the heat sink 180 is sloped because the bottom surface of the pole168 is sloped. In the embodiment shown, a portion of the bottom surfaceof the pole 168 proximate to the ABS is not parallel to the top surfaceof the NFT 100. In some embodiments, this portion of the bottom surfaceof the pole 168 may be configured to be parallel to the top surface ofthe NFT 120.

The NFT 122 includes a disk 124 and a pin 122. The pin 122 is betweenthe disk 124 and the ABS. Thus, the disk 124 is recessed from the ABS.In the embodiment shown, the disk 124 extends further in the track widthdirection (perpendicular to the plane of the page in FIG. 6) than thepin 122. In other embodiments, another relationship between the widthsis possible. In addition, although depicted as having a circular shapein the plan view of FIG. 5, the disk 124 may have another shape. Thedisk 124 is formed in step 102 of the method 100. Thus, the disk 124 maybe metallic. In contrast, the pin 122 is formed in step 104 and mayconsist of a different material than the disk 124. A dielectric having alow loss, a high index of refraction and mechanical stability may bedesired for the pin 122. For example, the pin 122 may be a Ta₂O₅ pin. Inother embodiments, a silicon or other dielectric pin may be formed. TheNFT 120 is, therefore, a composite NFT.

In operation the waveguide 170 directs energy from the laser to the ABSand more specifically to the NFT 120. The NFT 120 is optically coupledwith the waveguide 170, receiving energy from the core 174. The NFT 120is also proximate to the ABS. For example, the NFT 120 is shown ashaving a surface of the pin 122 occupying part of the ABS. The NFT 120focuses energy from the waveguide 170 onto a region of the media 112. Inparticular, a surface plasmon resonance may developed across the disk124 of the NFT 120. This resonance allows the NFT 120 to deliver opticalenergy to the media 112 in a small thermal spot. The write pole 168 isconfigured to write to the region of the media heated by the NFT 120.The heat sink 180 is thermally coupled near its bottom with the NFT 120and at its top with the bottom surface of the pole 168. Duringoperation, therefore, heat generated at the NFT 120 may be conducted bythe heat sink 180 away from the NFT 120 and to the pole 168.

The HAMR transducer 160 and thus the HAMR head 150 may have improvedperformance and reliability. Because the NFT 120 is formed using themethod 100, the NFT 120 may be a composite NFT 120. More specifically,the geometry of the pin 122 may be photolithographically defined. Thus,the pin may have the desired geometry yet be formed of differentmaterials from the disk 124. For example, a dielectric having increasedhardness may be used for the pin 122 while a metal is used for the disk124. The pin 122 is, therefore, more robust and less likely to fail.Performance and reliability of the NFT 120 and HAMR head 150 may thus beimproved.

FIG. 7 is a flow chart depicting a method 200 for providing a disk drivesuch as the disk drive 110 depicted in FIG. 4 and including the head150. For simplicity, some steps may be omitted, interleaved, and/orcombined. The method 200 is also described in the context of providing asingle disk drive 110 including a single HAMR transducer. However, themethod 200 may be used to fabricate multiple transducers atsubstantially the same time. The method 200 is also described in thecontext of particular layers. However, in some embodiments, such layersmay include multiple sub-layers. Certain steps of the method 200 may becombined, omitted, performed in another order and/or interleaved. Forsimplicity, the method 200 is described in the context of the disk drivedepicted in FIGS. 4-6.

Referring to FIGS. 4-7, the media 112 is provided, via step 202. TheHAMR head 150 residing on a slider is provided, via step 204. Step 204may thus fabricate or obtain the head 150 depicted in FIGS. 4-6. Also instep 204, the disk drive 110 may be assembled, including affixing theslider to a suspension or analogous structure. Thus, the disk drive 110may be fabricated. As a result, the benefits of the composite NFT 120may be achieved.

FIG. 8 is a flow chart depicting an exemplary embodiment of a method 210for fabricating a composite NFT in a HAMR transducer. For simplicity,some steps may be omitted, interleaved and/or combined. FIGS. 9A and9B-23A and 23B are diagrams depicting various portions of an exemplaryembodiment of a magnetic recording transducer 250 during fabrication.For clarity, FIGS. 9A and 9B-23A and 23B are not to scale. Further,although FIGS. 9A and 9B-23A and 23B depict the ABS location (locationat which the ABS is to be formed) and the ABS at a particular point inthe pole, other embodiments may have other locations for the ABS.Referring to FIGS. 8-23A and 23B, the method 210 is described in thecontext of the HAMR transducer 250. However, the method 210 may be usedto form another device (not shown). The HAMR transducer 250 beingfabricated may be part of a merged head that also includes a read head(not shown in FIGS. 9A and 9B-23A and 23B), a laser (not shown in FIGS.9A and 9B-23A and 23B) and resides on a slider (not shown) in a diskdrive. In addition, other portions of the HAMR transducer 250, such asthe pole(s), shield(s), coil(s), and remaining optics are not shown. Themethod 210 also may commence after formation of other portions of theHAMR transducer 250. For example, a tantalum oxide core for thewaveguide may have been formed. The method 210 is also described in thecontext of providing a single HAMR transducer 250 and a single compositeNFT in the HAMR transducer 250. However, the method 210 may be used tofabricate multiple transducers and/or multiple heat sinks per transducerat substantially the same time. The method 210 and device 250 are alsodescribed in the context of particular layers. However, in someembodiments, such layers may include multiple sublayers.

FIGS. 9A and 9B depict side and plan views, respectively, of the devicearea, the grating area and the NFT electronic lapping guide (ELG) areabefore the method 210 starts. Thus, the cladding 251 and core 252 of thewaveguide have been formed. An additional thin cladding layer 253 hasalso been provided. The cladding 252 and 253 are dielectrics, such asSiO₂. The core 252 is a dielectric such as Ta₂O₅. In other embodiments,other material(s) may be used. The grating 254 has also been formed.Also shown is the conductive layer 256 used for the NFT ELG. In someembodiments, the conductive layer 256 is a Ru layer.

A protective layer having an aperture in the region in which the NFT isto be formed is provided, via step 212. In some embodiments, theprotective layer is an aluminum oxide layer having a nominal thicknessof sixty nanometers. Step 212 may include depositing the aluminum oxidelayer using atomic layer deposition (ALD). However, in otherembodiments, other material(s) and/or other deposition methods may beused. FIGS. 10A and 10B depict plan and side views, respectively, of thedevice, grating and NFT ELG regions after step 212 is performed. Thus, aprotective layer 258 has been provided. The grating and NFT ELG regionsare covered by the protective layer 258. However, the dielectric(cladding) layer 253 is exposed by the aperture in the protective layerin the device region.

The layer(s) for the disk of the NFT are provided, via step 214. In someembodiments, step 214 includes depositing a stack including a Ta₂O₅layer and a gold layer. FIGS. 11A and 11B depict plan and side views,respectively, of the device, grating and NFT ELG regions after step 212is performed. Thus, a tantalum oxide layer 259, a gold layer 260 areshown.

The layers are patterned to form a disk, via step 215. Step 215 includesforming a hard mask. Thus, hard mask layers may be deposited andphotolithographically patterned. The underlying layers 259 and 260 maythen be patterned. FIGS. 12A and 12B depict plan and side views,respectively, of the device, grating and NFT ELG regions after the hardmask layers are provide as part of step 215. Thus, a silicon oxide layer262 and amorphous carbon layer 264 (α-carbon) have been formed. Thelayers 262 and 264 are used as a mask. FIGS. 13A and 13B depict plan andside views, respectively, of the device, grating and NFT ELG regionsafter step 215 has been performed. Thus, etches or other removal stepsappropriate for layers 264, 262, 260 and 259 are performed. For example,layers 259, 262 and 264 may be removed by RIEs, while the gold layer 260may be removed using an ion mill. A disk has been formed of layers 259,260, 262 and 264.

The region of the NFT ELG may be milled, via step 216. For example, theexposed portion of the cladding layer 253 and underlying conductive ELGlayer 256 may be milled. FIGS. 14A and 14B depict plan and side views,respectively, of the device, grating and NFT ELG regions after step 216is performed. Thus, the NFT ELG may be patterned.

A photoresist mask having an aperture for the NFT pin is provided, viastep 217. Use of a photoresist mask allows for lift-off and, therefore,easier fabrication of the NFT pin. FIGS. 15A and 15B depict plan andside views, respectively, of the device, grating and NFT ELG regionsafter step 217 is performed. Thus, a mask 266 with aperture 268 has beenformed. As can be seen in FIG. 15B, a portion of the aperture 268overlaps the disk layers.

The layer(s) for the dielectric pin are deposited, via step 218. In someembodiments, step 218 includes depositing a tantalum oxide pin. In otherembodiments, other material(s) may be used. A portion of the layer(s)for the dielectric pin reside on the mask 266. Another portion residesin the aperture 268. The photoresist mask 266 is lifted off, via step220. FIGS. 16A and 16B depict plan and side views, respectively, of thedevice, grating and NFT ELG regions after step 220 is performed. Thus,the remaining dielectric 270 is shown. The dielectric 270 has a pinportion near the disk and an anchor portion on the opposite side of theABS location from the disk. The dielectric layer 270 may be nominallytwenty nanometers thick. In some embodiments, the length of the pinlayer 270 from the ABS to the disk is desired to be at least tennanometers and not more than fifteen nanometers. As can be seen in FIG.16B, the ABS location is within the portion of the dielectric layer 270on the side of the layers 259, 260, 262 and 264. Thus, in the embodimentshown, the pin of the NFT is formed from the portion of the dielectriclayer 270 deposited on the sides of the disk. In some embodiments,therefore, the thickness of the dielectric layer 270 deposited isgreater than the length of the pin.

The alumina protective layer is removed, via step 222. In someembodiments, step 222 includes performing an alumina wet etch. FIGS. 17Aand 17B depict plan and side views, respectively, of the device, gratingand NFT ELG regions after step 222 is performed. Thus, the protectivelayer 258 has been removed.

A first cladding, or dielectric, layer is deposited, via step 224. Insome embodiments, a silicon dioxide layer is deposited in step 224. Thethickness of the layer may be at least fifty nanometers in someembodiments and not more than seventy-five nanometers. FIGS. 18A and 18Bdepict plan and side views, respectively, of the device, grating and NFTELG regions after step 224 is performed. Thus, the first cladding layer272 has been deposited. In some embodiments, the first cladding layer272 has a top surface at the same height as the top of the gold layer260 in the region around which the NFT is being formed. Thus, thethickness of the first cladding layer 272 may depend upon the thicknessof the NFT disk.

An endpoint detection layer is deposited, via step 226. In someembodiments, ten nanometers of amorphous carbon is deposited in step226. In other embodiments, Ta may be used for the endpoint detectionlayer. FIGS. 19A and 19B depict plan and side views, respectively, ofthe device, grating and NFT ELG regions after step 226 is performed.Thus, the endpoint detection (EPD) layer 274 is shown. In the embodimentshown, the EPD layer is deposited in substantially the same locationthat the alumina protective layer 258 occupied. Thus, a lift-off processis used to pattern the EPD layer 274 in step 226. For example, aphotoresist mask covering part of the device area and part of the NFTELG region is provided. The EPD layer 274 is deposited and the masklifted off. The remaining EPD layer 274 is shown in FIGS. 19A and 19B.

A second cladding layer is deposited, via step 228. Thus, an additionaldielectric layer is deposited. In some embodiments, a silicon dioxidelayer that is nominally fifty nanometers thick is provided in step 228.FIGS. 20A and 20B depict plan and side views, respectively, of thedevice, grating and NFT ELG regions after step 228 is performed. Thus,an additional cladding layer 276 has been provided.

A planarization step is then performed, via step 230. In someembodiments, a resist planarization is performed in step 230. Forexample, the top layer(s) 272 and 276 may be ion milled. The ion millterminates based on detection of the EPD layer 274. FIGS. 21A and 21Bdepict plan and side views, respectively, of the device, grating and NFTELG regions after step 230 is performed. Thus, the top surfaces of theremaining portions of layers 276, 272 and 262 are substantially levelwith the top surface of the remaining portion of the EPD layer 274.

The EPD layer 274 is removed, via step 232. For an amorphous carbon EPDlayer 274, the layer 274 may simply be burned off. This process may alsoremove the amorphous carbon layer 264 on the disk. Further, the topsurface of the transducer 250 may no longer be flat. Consequently, athin cladding layer may be deposited and an additional planarization,such as a light (or kiss) CMP, may performed in step 232. This stepremoves the EPD layer 274 while allowing the top surface of thetransducer 250 to remain substantially planar. FIGS. 22A and 22B depictplan and side views, respectively, of the device, grating and NFT ELGregions after step 232. Thus, the EPD layer 274 has been removed. Thetop amorphous carbon layer 264 of the disk has also been removed in step232. The gold disk 260 for the NFT has also been exposed.

Fabrication of the HAMR transducer 250 may then be completed, via step234. For example, regions around the NFT may be refilled and otherstructures formed. Further, the device may be lapped back to the ABSlocation. FIGS. 23A and 23B depict plan and side views, respectively, ofthe device, grating and NFT ELG regions after at least part of step 234is performed. Thus, the ABS has been exposed, for example by lapping.Further, the composite NFT 280 is formed by the metallic disk 260 andthe dielectric pin 270. As can be seen in FIG. 23B, a portion of the pin270 is at the ABS, while the metallic disk 260 is recessed from the ABS.In the embodiment shown, the disk 260 is wider than the pin 270. Inother embodiments, however, other configurations may be used.

Thus, using the method 210, the HAMR transducer 250 may be fabricated.The HAMR transducer has an NFT 280 having the desired geometry,including pin width, as well as the desired combination of materials.The method 210, NFT 280, and HAMR transducer 250 share the benefits ofthe method 100, the NFT 120 and the HAMR head 150. Consequently,manufacturing, reliability, and performance of the HAMR transducer 250may be improved.

We claim:
 1. A method for providing a near-field transducer (NFT) for aheat assisted magnetic recording (HAMR) device, the method comprising:forming disk of the NFT from a first material; forming a pin of the NFTfrom at least a second material different from the first material, thepin contacting the disk, at least a portion of the pin residing betweenthe disk and an air-bearing surface (ABS) location, wherein forming thepin further includes: providing a mask having an aperture therein, atleast a portion of the aperture having a shape and a location of thepin; depositing the at least the second material; and lifting off themask, wherein the mask is a photoresist mask; and providing an aluminaprotective layer comprising a NFT aperture therein, the NFT apertureexposing a region including the disk and the pin.
 2. The method of claim1 wherein the first material is a metal and the at least the secondmaterial includes a dielectric.
 3. The method of claim 1 furthercomprising: removing the alumina protective layer after lifting off themask.
 4. The method of claim 1 wherein forming the pin further includes:providing at least one dielectric layer; and planarizing the at leastone dielectric layer.
 5. The method of claim 4 wherein providing the atleast one dielectric layer further includes: providing a first claddinglayer; and providing a second cladding layer on the first claddinglayer.
 6. The method of claim 5 wherein forming the pin furtherincludes: depositing an endpoint detection layer on the first claddinglayer, the endpoint detection layer being between the first claddinglayer and the second cladding layer.
 7. The method of claim 6 whereinplanarizing includes performing a resist planarization.
 8. The method ofclaim 7 wherein planarizing further includes a chemical mechanicalplanarization.
 9. A method for providing a near-field transducer (NFT)for use in a heat-assisted magnetic recording (HAMR) device comprising:providing an alumina protective layer having a NFT aperture therein, theNFT aperture exposing a region including an NFT location; forming diskof the NFT from at least one metal, the disk residing in the NFTaperture; forming a pin of the NFT from at least one dielectric, the pinresiding in the NFT aperture, a portion of the pin contacting a portionof the disk and residing between the disk and an air-bearing surface(ABS) location, wherein forming the pin further including: providing aresist mask comprising an aperture therein, at least a portion of theaperture having a shape and a location corresponding to the pin;depositing the at least one dielectric; lifting off the resist mask, aremaining portion of the at least one dielectric including the pin;removing the alumina protective layer after the step of lifting off themask; providing a first cladding layer, the first cladding layerincluding silicon oxide; depositing a Ta endpoint detection layer on thefirst cladding layer; providing a second cladding layer on the Taendpoint detection layer, the second cladding layer including thesilicon oxide; resist planarizing the at least one dielectric layer; andperforming a chemical mechanical planarization after the resistplanarization.